Modeling Suite - Agilent Technologies

Parent Category: Rocktabs Archive

1407 HFE hotProducts03

Modeling Suite

Agilent Technologies announced several innovations for its suite of device modeling and characterization software tools. The suite comprises Agilent EEsof EDA’s Integrated Circuits Characterization and Analysis Program (IC-CAP), Model Builder Program (MBP), and Model Quality Assurance (MQA). The release features three advanced device modeling packages for Agilent’s DynaFET, BSIM6, and BSIM-CMG models.

Agilent Technologies