Parent Category: Rocktabs Archive

Hermetic Ceramic Leadless SMT Substrates and Packages

Remtec designs and manufactures cost effective hermetic ceramic leadless SMT substrates and packages for RF and microwave components as well LEADLESS-HERMETIC-CERAMIC-SMT_2-(1)as multichip modules for direct PCB mount. An SMT package built with PCTF® (Plated Copper on Thick film) Technology includes three essential features: copper metallization, copper-plated solid plugged hermetic via holes, and PCTF wraparounds (castellations). Copper metallization is quite suitable for RF signal transmission and also creates an excellent heat spreading effect beneath a semiconductor die.

Remtec
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