Thursday, June 20, 2019
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EMC Products

ON Semiconductor www.onsemi.com
SolaHD www.solahd.com
Ferroxcube www.ferroxcube.com

Power Devices

Cree, Inc. www.cree.com
Skyworks Solutions, Inc. www.skyworksinc.com
Microsemi Corporation www.microsemi.com
JFW Industries www.jfwindustries.com
Nitronex www.nitronex.com

Sensors

Fastrax Ltd. www.fastraxgps.com
Radiocrafts AS www.radiocrafts.com
Libelium www.libelium.com
Nextreme Thermal Solutions www.nextreme.com
Spacek Labs www.spaceklabs.com

Product Highlights

AR RF/Microwave Instrumentation www.arworld.us

Linear Technology Corporation www.linear.com

Mini-Circuits www.minicircuits.com

Connor-Winfield www.conwin.com

Aethercomm www.aethercomm.com

ACS www.appliedmicrowave.com

MITEQ, Inc. www.MITEQ.com

New Products

Crystek Corporation www.crystek.com

RF Micro Devices, Inc. www.rfmd.com

Linear Technology Corporation www.linear.com

Anritsu Company www.anritsu.com

Valpey Fisher Corporation www.valpeyfisher.com

TriQuint Semiconductor www.triquint.com

Mini-Circuits www.minicircuits.com

Analog Devices, Inc. www.analog.com

Aeroflex Limited www.aeroflex.com

Rohde & Schwarz www.rohde-schwarz.com

Lansdale Semiconductor, Inc. www.lansdale.com

Empower RF Systems www.EmpowerRF.com

Rakon Limited www.rakon.com

Spacek Labs www.spaceklabs.com

Agilent Technologies www.agilent.com

Computer Simulation Technology www.cst.com

W.L. Gore & Associates, Inc. www.gore.com

Skyworks Solutions, Inc. www.skyworksinc.com

Laird Technologies, Inc. www.lairdtech.com

BGA Pocket Adapter

1811 hotProducts03

BGA Pocket Adapter

Ironwood Electronics' new high performance BGA Socket Adapter, LS-BGA256E-15, allows user to convert compression mount BGA socket which needs mounting holes (in target PCB) into conventional through hole soldering options. The adapter consists of machined Brass pins pressed into an FR4 wafer. The top side of adapter has gold plated pads to receive socket interconnect and the bottom side has 0.008" diameter pin tails. The adapter can be soldered to any thru-hole pattern using conventional soldering methods or plugged into mating female receptacle.

Ironwood Electronics
ironwoodelectronics.com

June 2019

1906 HFE cover

The June 2019 Online Edition is now available for viewing and download!

Download June HFE PDF

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Web Exclusives

AWR

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Product

Release 3.1 of AntSyn™ antenna design, synthesis, and optimization software is now available for use by current customers and evaluators. Firms like Striiv, who develops sports activity trackers, have found this innovative EM-based antenna synthesis tool valuable for designing antenna solutions for IoT/wireless devices. Learn more about the features of this new release at https://www.awrcorp.com/news/article/antsyn-31-release-now-available

White Paper/App Note

A new 5G primer on MIMO and phased-array antennas highlighting key features of the NI AWR Design Environment platform is now available for engineers, managers, and system integrators designing these devices to meet complex 5G requirements. Register to receive this primer/white paper at http://awrcorp.com/resource-library/5g-primer-mimophased-array-antennas


Contact Us

Scott Spencer
Publisher
603-759-1840

Tim Burkhard
Associate Publisher
707-544-9977
Fax: 707-544-9375

Gary Rhodes
VP Sales
631-274-9530
Fax: 631-667-2871

Jeff Victor
Advertising Sales - Western U.S. - New Accounts
224-436-8044
Fax: 509-472-1888

Sam Baird
Advertising Sales - UK and Europe
+44 1883 715 697
Fax: +44 1883 715 697

Joanne Frangides
Advertising Sales - New Accounts & Product Showcase
201-666-6698
Fax: 201-666-6698

Insulated Wire Inc.

Insulated Wire Inc. is pleased to announce that following the retirement of a French delegate, IW Microwave Products Division President, John Morelli, has been appointed as the Secretary for IEC/SC46F, a subcommittee of IEC/TC46. IEC/SC46F is responsible for RF and Microwave Connectors and Components International Standardization.

Mr. Morelli, who is sponsored by Insulated Wire, brings significant RF/Microwave connector and component experience to the position, and we congratulate him on his new appointment. Mr. Morelli had been serving as the chief Technical Advisor for the US National Committee’s Technical Advisory Group to IEC/SC46F.

The US National Committee of the IEC is a fully integrated entity of the American National Standards Institute (ANSI).

Coming Events

IMS 2019, Boston, June 2 - 7, 2019

IEEE EMC + SIPI, New Orleans, July 22 - 26, 2019

IEEE AUTOTESTCON, National Harbor, MD, September 9 – 12, 2019

EuMW 2019, Paris, September 29 - October 4, 2019

MILCOM 2019, location TBD, October 2019 (date TBD)

AOC, Washington, DC, October 28 - 30, 2019

IEEE Radio and Wireless Symposium, location TBD, January 2020 (date TBD)